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data sheet 4-ch linear constant current sink with matching AP2502 oct. 2010 rev 1. 1 bcd semiconductor manufacturing limited 1 general description the AP2502 is a 4-channel independent linear current sink with low dropout voltage and perfect match between each channel. each channel can provide 20ma continuous constant current. in application, there is only one 0.1 f ceramic capacitor required, and there is no any emi and switching noise issue. it is perfect choice for hand-hold portable system especially based on li-ion/polymer battery powered display module. the brightness can be controlled and/or adjustable via simple pwm signal applied to en pin. the AP2502 is available with sot-23-6 and tsot-23-6 packages. features ? current matching between each channel: 1% ? low dropout voltage: 65mv (typ.) @ i led = 20ma ? maximum output current on each channel: 20ma ? ultra-low quiescent current: 125 a (typ.) ? ultra-low shutdown current: 1 a (max.) ? none emi and switching noise issue ? permitted pwm dimming frequency up to ? 150khz ? otsd protection applications ? mobile phone, smart phone, pda ? mp3, mp4, pmp ? small size backlight module figure 1. package types of AP2502 sot-23-6 tsot-23-6
data sheet 4-ch linear constant current sink with matching AP2502 oct. 2010 rev 1. 1 bcd semiconductor manufacturing limited 2 pin configuration k/kt package (sot-23-6/tsot-23-6) figure 2. pin configuration of AP2502 (top view) pin descriptions p in number pin name description 1 en chip enable pin, active high to permit pw m signal input for brightness control by changing duty cycle 2 gnd gnd 3, 4, 5, 6 led4 to led1 led cathode terminal for channel number
data sheet 4-ch linear constant current sink with matching AP2502 oct. 2010 rev 1. 1 bcd semiconductor manufacturing limited 3 functional block diagram figure 3. functional block diagram of AP2502
data sheet 4-ch linear constant current sink with matching AP2502 oct. 2010 rev 1. 1 bcd semiconductor manufacturing limited 4 ordering information AP2502 - circuit type g1: green package tr: tape & reel k: sot-23-6 kt: tsot-23-6 package temperature range part number marking id packing type sot-23-6 -40 to 85 c AP2502ktr-g1 gee tape & reel tsot-23-6 -40 to 85 c AP2502kttr-g1 l7e tape & reel bcd semiconductor's pb-free products, as designated with "g1" suffix in the part number, are rohs compliant and green. absolute maximum ratings (note 1) note 1: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability. parameter symbol value unit enable input voltage v en -0.3 to 6.5 v thermal resistance (jun ction to ambient) ja 250 oc/w operating junction temperature range t j 150 oc storage temperature range t stg -65 to 150 oc lead temperature (soldering,10 seconds) t lead 260 oc esd (machine model) 600 v esd (human body model) 6000 v
data sheet 4-ch linear constant current sink with matching AP2502 oct. 2010 rev 1. 1 bcd semiconductor manufacturing limited 5 recommended operating conditions electrical characteristics v in =3.6v, v f_led =3.2v, t a = 25c, unless otherwise specified. parameter symbol test conditions min typ max unit led dropout voltage v dropout i sink =20ma 65 120 mv enable pin high voltage v ih 2 6 v enable pin low voltage v il 0 0.5 v led maximum sin k current i led(max) v cc =3.3 to 6.0v, enable=v cc 18 20 22 ma sink current matching between each channel i led-match v led =0.4v 0.5 1 % quiescent current i q i led1 =i led2 =i led3 =i led4 =20ma 125 180 a shutdown current i shutdown set en pin low 0.1 1 a thermal resistance (junction to case) jc 80 c/w pwm frequency to adjust brightness f pwm 150 khz en pin pulse high time t high 1 s en pin pulse low time t low 100 ns thermal shutdown temperature t otsd 150 thermal shutdown hysteresis t hyotsd 25 c value parameter symbol min max unit enable input voltage v en 2.0 6.0 v operating temperature range t a -40 85 c sink current i led 20 ma
data sheet 4-ch linear constant current sink with matching AP2502 oct. 2010 rev 1. 1 bcd semiconductor manufacturing limited 6 -40 -20 0 20 40 60 80 100 120 140 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 led open v en =3v quiescent current ( a) case temperature ( o c) 1234567 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 led open t c =-40 o c t c =25 o c t c =85 o c quiescent current ( a) enable voltage (v) 0 100 200 300 400 500 600 700 800 900 1000 0 2 4 6 8 10 12 14 16 18 20 22 v en =3v t c =-40 o c t c =25 o c t c =85 o c i led (ma) output voltage (mv) -40-20 0 20406080100120 19.0 19.2 19.4 19.6 19.8 20.0 20.2 20.4 20.6 20.8 21.0 v en =3v v in =4v i led (ma) case temperature ( o c) typical performance characteristics figure 4. quiescent current vs. case temperature figure 5. quiescent current vs. enable voltage figure 6. led current vs. case temperature figure 7. led current vs. output voltage
data sheet 4-ch linear constant current sink with matching AP2502 oct. 2010 rev 1. 1 bcd semiconductor manufacturing limited 7 -40 -20 0 20 40 60 80 100 120 140 20 30 40 50 60 70 80 90 100 110 120 dropout voltage (mv) case temperature ( o c) -40 -20 0 20 40 60 80 100 120 140 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 v en =3v v led =300mv current matching (%) case temperature ( o c) 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 16.0 16.5 17.0 17.5 18.0 18.5 19.0 19.5 20.0 20.5 21.0 21.5 22.0 22.5 23.0 23.5 24.0 v led =300mv t c =25 o c i led (ma) enable voltage (v) 0 102030405060708090 -10 0 10 20 30 40 50 60 70 80 90 100 110 f=100hz f=10khz f=100khz f=150khz t c =25 o c led current efficiency (%) duty cycle (%) 99 typical performance characteristics (continued) figure 8. dropout voltage vs. case tem perature figure 9. cu rrent matching vs. case temperature figure 10. led current vs. enable voltage figure 11. led current efficiency vs. duty cycle
data sheet 4-ch linear constant current sink with matching AP2502 oct. 2010 rev 1. 1 bcd semiconductor manufacturing limited 8 typical performance characteristics (continued) figure 12. led current (note 2) figure 13. internal oscillator working at low frequency (v in =4v, v en =0 to 3.6v, duty cycle=50%, f pwm =1khz) (v in =4v, v en =0 to 3.6v, duty cycle=50%, f pwm =0.1khz) note 2: chopper offset-canceling technology is adopted to get good current matching, i led =[(i 1 +i 2 )/2]*duty. v en 2v/div i led 10ma/div time 400 s/div i 1 i 2 time 2ms/div v en 2v/div i led 10ma/div
data sheet 4-ch linear constant current sink with matching AP2502 oct. 2010 rev 1. 1 bcd semiconductor manufacturing limited 9 typical application figure 14. AP2502 typical application
data sheet 4-ch linear constant current sink with matching AP2502 oct. 2010 rev 1. 1 bcd semiconductor manufacturing limited 10 mechanical dimensions so t-23-6 unit: mm(inch) 2.820(0.111) 3.020(0.119) 0.950(0.037)typ 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)ref 0.100(0.004) 0.200(0.008) 0 8 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 1.450(0.057) max 123 4 5 6 pin 1 dot by marking
data sheet 4-ch linear constant current sink with matching AP2502 oct. 2010 rev 1. 1 bcd semiconductor manufacturing limited 11 mechanical dimensions (continued) tsot-23-6 unit: mm(inch) 2.800(0.110) 3.000(0.118) 1.500(0.059) 1.700(0.067) 2.600(0.102) 3.000(0.118) 0.950(0.037) bsc 1.900(0.075) bsc 0.700(0.028) 0.900(0.035) 0.000(0.000) 0.100(0.004) 0.350(0.014) 0.510(0.020) 0 8 0.370(0.015) min 0.100(0.004) 0.250(0.010) 0.250(0.010) bsc gauge plane r0.100(0.004) min pin 1 dot by marking 1.000(0.039) max
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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